UJUJ BQ Series BM030-I60B-C06-C (Male) & BF030-I60B-C06-C (Female) 0.3mm Pitch Board-to-Board Connectors
Ultra-Slim, High-Reliability Interconnect Solution for Space-Constrained Applications

Product Overview

UJUJ’s BQ Series BM030-I60B-C06-C (male header) and BF030-I60B-C06-C (female socket) are high-density board-to-board (B2B) connectors designed to deliver exceptional stability and space efficiency in next-generation electronics. Featuring a 0.3mm ultra-fine pitch and 0.6mm slim stacking height, these connectors are engineered for compact devices requiring robust signal integrity and mechanical durability. With advanced Double Contact and Bellows Type Contact Structure, the BQ Series ensures reliable performance in consumer electronics, automotive systems, and industrial IoT applications.

Key Features

1. Enhanced Contact Stability

• Double Contact Design: Dual-point contact terminals minimize resistance fluctuations and ensure stable electrical connections, even under vibration or thermal stress.

• Bellows Type Contact Structure: Corrugated spring design absorbs mechanical stress, preventing contact deformation and maintaining long-term reliability.

2. Space-Saving Design

• 0.3mm Ultra-Fine Pitch: Enables high-density PCB layouts, ideal for smartphones, wearables, and micro-sensor modules.

• 0.6mm Slim Stacking Height: Reduces vertical space consumption, supporting multi-board stacking in ultra-thin devices.

3. Robust Mechanical Construction

• Functional Fitting Nail:

• Mold Prevention of Damage: Reinforced housing with anti-warping ribs protects terminals during automated assembly.

• High Current Support: Rated for 0.5A per contact (up to 60 pins), suitable for power and signal hybrid transmission.

• Full-Insert Terminal Structure: Male and female terminals are fully embedded into the insulator, preventing base damage and enhancing structural strength.

4. Environmental Resilience

• Wide Temperature Range: Operates reliably from -40°C to +125°C, meeting automotive and industrial-grade requirements.

• Anti-Corrosion Plating: Gold-plated terminals (0.15µm min) ensure low contact resistance and resistance to oxidation.

Technical Specifications

Applications

1. Consumer Electronics

• Foldable Smartphones: Connect flexible displays to mainboards with high-density 0.3mm pitch, enabling seamless hinge integration.

• TWS Earbuds: Ultra-slim 0.6mm height supports compact charging case designs.

• AR/VR Headsets: Transmit high-speed data between micro-displays and processing units.

2. Automotive Electronics

• ADAS Modules: Reliable connections for LiDAR, radar, and camera PCBs in autonomous driving systems.

• In-Cabin Controllers: Link infotainment touchscreens to ECUs, withstanding vibration and temperature extremes.

3. Industrial & Medical Devices

• Robotic Arms: Durable interconnects for motor control boards in high-vibration environments.

• Portable Monitors: Ensure stable signal transmission in handheld ultrasound or patient monitoring devices.

4. IoT & Edge Computing

• Smart Sensors: Enable miniaturized designs for environmental or motion-sensing modules.

• 5G Modules: Support high-speed data transfer in compact IoT gateways.

Competitive Advantages

• Superior Durability: The bellows contact structure extends lifespan by 40% compared to conventional single-spring designs.

• High-Current Capacity: Supports hybrid power-signal transmission, reducing the need for separate power connectors.

• Automation-Friendly: Functional fitting nails and anti-misalignment guides streamline pick-and-place assembly.

Design Guidelines

1. PCB Layout:

• Maintain a minimum clearance of 0.2mm between adjacent connectors to prevent short circuits.

• Use ground shielding beneath connectors to minimize EMI in high-frequency applications.

2. Assembly:

• Recommended reflow soldering profile: Peak temperature ≤260°C, dwell time ≤10 seconds.

3. Mating Alignment:

• Utilize guide posts or alignment marks to prevent offset during board stacking.

Why Choose UJUJ BQ Series?

• Space Optimization: 0.3mm pitch frees 25% more PCB area than 0.4mm alternatives.

• Reliability-First Design: Full-insert terminal structure reduces failure rates by 60% in drop tests.

• Industry Compliance: Meets AEC-Q200 (automotive) and IEC 60512 (industrial) standards.

Conclusion

UJUJ’s BM030-I60B-C06-C and BF030-I60B-C06-C connectors redefine high-density interconnects with their innovative Double Contact technology and ultra-slim profile. Designed for applications demanding precision, durability, and space efficiency, this series is a cornerstone for next-generation electronics in automotive, consumer, and industrial markets.

Contact UJUJ today to request samples, technical documents, or customized solutions tailored to your project needs!