LCN (LCN Electronics) JM81-M04400130 (Male) & JM81-F04400130 (Female) 0.4mm Pitch Board-to-Board Connectors

Introduction

LCN’s JM81-M04400130 (male header) and JM81-F04400130 (female socket) are ultra-compact, high-density board-to-board (B2B) connectors designed for next-generation miniaturized electronics. Featuring a 0.4mm pitch and an ultra-low 0.8mm mating height, these connectors address the growing demand for space-saving solutions in consumer electronics, automotive systems, and IoT devices. Manufactured by QianDe Electronics, a leading Chinese precision connector innovator8, this series combines advanced engineering with robust performance, making it ideal for applications requiring reliable interconnections in constrained spaces.

Product Overview

The JM81-M/F04400130 series is part of LCN’s high-precision B2B connector portfolio, optimized for vertical stacking and modular PCB designs. Key specifications include:

• Pitch: 0.4mm

• Mating Height: 0.8mm

• Contact Material: Phosphor bronze with gold plating (0.2µm min) for low resistance and corrosion resistance8.

• Rated Current/Voltage: 0.3A per contact, 50V AC/DC.

• Operating Temperature: -40°C to +85°C, suitable for harsh environments8.

Key Features

1. Ultra-Miniature Design

• 0.4mm Pitch: Enables high-density PCB layouts, critical for slim devices like foldable smartphones and wearables.

• 0.8mm Mating Height: Reduces vertical space consumption, supporting ultra-thin industrial sensors and medical monitors8.

2. High Reliability

• Advanced Plating Technology: Utilizes LCN’s proprietary rhodium-ruthenium alloy plating for enhanced resistance to electrolytic corrosion, ensuring long-term stability8.

• Four-Side Bare Nickel Plating: Isolates solder and contact areas to prevent tin whiskering and connectivity issues8.

3. Robust Mechanical Performance

• Reinforced Locking Mechanism: Prevents disconnection under vibration or shock, ideal for automotive and robotics applications.

• Smooth Mating Force: <15N insertion/withdrawal force for easy assembly and maintenance.

4. Environmental Compliance

• RoHS and REACH compliant, aligning with global sustainability standards8.

Technical Specifications

Applications

1. Consumer Electronics

• Foldable Smartphones: Connect flexible display modules and sub-PCBs in hinge designs8.

• Wearables: Enable compact layouts in smartwatches (e.g., sensor-to-mainboard links)8.

• AR/VR Headsets: Interface high-resolution displays with processing units.

2. Automotive Electronics

• ADAS Modules: Link LiDAR, camera, and radar PCBs in advanced driver-assistance systems.

• Infotainment Systems: Connect touchscreens to control units in dashboards8.

3. Industrial IoT

• Robotics: Provide reliable interconnects for motor control boards and sensor arrays.

• Smart Meters: Support modular designs in energy monitoring systems.

4. Medical Devices

• Portable Diagnostics: Ensure stable connections in handheld ultrasound or glucose monitors.

• Implantable Tech: Ultra-low-profile design for compact medical implants.

Competitive Advantages

• Space Efficiency: The 0.4mm pitch outperforms standard 0.5mm connectors, saving 20% PCB area8.

• Durability: Rhodium-ruthenium plating extends lifespan by 30% compared to conventional gold-plated connectors8.

• Customization: Available in multiple pin configurations (e.g., 10–60 pins) for scalable designs.

Design Guidelines

1. PCB Layout

• Maintain trace lengths ≤10mm between connectors and ICs to minimize signal loss.

• Use ground shielding beneath connectors to reduce EMI interference.

2. Assembly

• Recommended reflow soldering profile: Peak temperature ≤260°C8.

Conclusion

LCN’s JM81-M04400130 and JM81-F04400130 connectors redefine miniaturization in B2B connectivity. With their ultra-fine pitch, rugged construction, and industry-leading plating technologies, these connectors empower engineers to innovate across consumer, automotive, and industrial sectors. Backed by QianDe’s expertise in precision manufacturing8, this series is a future-proof solution for next-gen electronics demanding reliability in compact form factors.

For OEMs seeking to optimize space without compromising performance, the JM81 series delivers unmatched value in high-density interconnection.